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Our Products
Heat Activated Dry Films To complement our line of pressure-sensitive laminating adhesives, Dielectric Polymers has expanded into the arena of heat activated films. Based on our converting capabilities and responsiveness in the marketplace, we have been selected by the Dow Chemical Company as its authorized, small quantity distributor for the INTEGRAL * adhesive films product line. DOW heat activated films are designed to be applied primarily by in-line lamination to web or roll stock, by one-step molding or by thermal bonding in a press. These dry film adhesives are also formulated to provide the one-side or two-side adhesion required in certain industrial applications. INTEGRAL * adhesive films are versatile in that they offer varying levels of adhesion on a variety of substrates. From excellent adhesion on metals, nonwovens, many plastics, glass and paper to good adhesion on fibers, rigid vinyl and rubber to peelable adhesion on flexible vinyl, polypropylene, and water-based adhesives, these adhesive films have your application covered. These films can be extruded in multiple layers to provide unique attributes such as barrier properties, protective and printable surfaces, slip characteristics and corrosion protection. In addition, INTEGRAL * adhesive films lend aesthetics and dimensional stability to laminating applications, with quick processing, simple cleanup and easy handling and storage. Low Temperature Activation Films: INTEGRAL * 801 adhesive film: This tie layer film provides adhesion at low processing temperatures, making it ideal in bonding temperature sensitive substrates such as synthetic fabrics. It is used as a protective film to provide scratch resistance for styrenic sheets and in refrigerator liners. This product has FDA compliance for specific direct food applications.
Intermediate Temperature Activation Films: INTEGRAL * 709 adhesive film: This multipurpose, low melt, low viscosity film is designed to act as a tie layer between porous substrates, such as foam to fabric laminations for specialty automotive applications. It is also used in bonding dissimilar materials, in urethane foam lamination and apparel applications.
INTEGRAL * 821 adhesive film: This low melting monolayer film provides high flow characteristics and superior wet-out properties for good penetration into porous substrates. It is used as an overlay for upgrading photographs, in photographic backings, in bonding dissimilar materials and as an anti-fraying agent in belt loop applications.
INTEGRAL * 933 adhesive film: This two layer film has a low melting, high flow adhesive layer which is useful in bonding to substrates such as polyurethane or polyethylene foam or to nonwoven textiles. It has high tear resistance and is used primarily for automotive interior trim applications such as headliner lamination and automotive water shields and in specialty carpet underlayment.
High Temperature Activation Films: INTEGRAL * 835 adhesive film: This tie layer film is a coextrusion of two different heat sensitive adhesive resins that is designed for bonding dissimilar substrates and medical tape applications.
INTEGRAL * E100 adhesive film: This multipurpose, monolayer film is versatile, bonding well to a variety of metals, fibers and plastics. It is used in automotive applications such as headliner lamination and bonding textiles and sound dampening materials in door panels. It is also used in bonding corrugated steel pipes and in index tab applications. This product can act as a tie layer to provide the bond between substrates and is available corona treated.
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| © Copyright 2000 Dielectric Polymers, Inc. |
Dielectric Polymers, Inc. 218 Race Street, Holyoke Massachusetts 01040 800-628-9007 info@dipoly.com |
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